Student Development

  • Student_Development_crop

  • About the AREA Consortium Student Development:
    Student funding was stated in 1992 with the onset of the Universal Ultra Fine Pitch (UFP) Consortium. More than $12M has been spent on student funding with various universities since that time. Since 1992 we have graduated approximately 200 students (mostly from Binghamton University, but also Cornell University, Columbia University, Clarkson University, Virginia Tech and Rochester Institute of Technology).

    Departments funded include:

    • Mechanical Engineering
    • System Science and Industrial Engineering
    • Physics
    • Electrical Engineering
    • Manufacturing Technology

    University funding covers tuition, stipend, on-job training, and Masters or PhD research content. Students graduate with practical experience and advanced degrees in engineering that can be leveraged for job placement and advancement.

    Training in:

    • UIC equipment
    • Materials evaluation and reliability testing
    • Surface mount manufacturing
    • Soldering, adhesives, rework
    • Failure analysis techniques (analytical tools and physical examination)

    Look below to see if there are candidates for open positions within your organization!

Featured Graduating Students

  • Francis_M_Mutuku

  • Francis M Mutuku
    Binghamton University Graduate Research Associate
    Graduate Department: Physics
    Faculty Adviser: Prof. Eric Cotts
    Universal Instruments Corporation Engineer Mentor: Dr. Babak Arfaei

    I received my Bachelor of Science (Physics and Math) degree from Egerton University in Kenya. In 2004, I received a Post graduate diploma in Education (PGDE) from the same University in Kenya. Where I taught high school Physics and Mathematics in Kenya for close to 11 years.

    In August 2008, I joined Binghamton University for a Master’s program in Physics and later in August 2010, I transitioned to PhD in Physics. I work under Professor Eric Cotts my research focus is on the effect of thermal history on the solidification temperature, microstructure and mechanical behavior of lead free solders. At Universal Instruments Corporation I am working as an associate research assistant under Babak Arfaei. Our research work focuses on the effect of thermal history, sample parameters and other factors such as Pad finish on the microstructure and shear fatigue life both at room temperature and Accelerated Thermal Cycling (ATC).

  • Nicholas_Graziano

  • Nicholas Graziano
    Binghamton University Research Assistant Graduate
    Department: Mechanical Engineering
    Faculty Advisor: Prof. Quang Su
    Universal Instruments Corporation Engineer Mentor: Dr. Harry Schoeller

    I am from Hartford, Connecticut and raised in Poughkeepsie, New York. I received my Bachelor’s of  Science in Mechanical Engineering from Binghamton University in May 2013. I began pursuing my Master’s in August 2013. It was during this time that I began my research with the Universal Instruments AREA Consortium. I am currently working on characterizing failure modes for drop testing and thermal cycling and analyzing these mechanisms through finite element modeling.

Our Current Students

  • Faramaz_Hadian

  • Faramaz Hadian
    Binghamton University Graduate Research Associate
    Graduate Department: Physics
    Faculty Adviser: Prof. Eric Cotts
    Universal Instruments Corporation Engineer Mentor: Dr. Harry Schoeller

    After graduating in B.Sc level from University of Urmia (Iran), I started working at a company, named Gas-Souzan, dealing with “Gas Pressure Regulators and Gas Meter”. I completed my master degree in Applied Physics at the University of Tabriz (Iran) then I was hired as a lecturer at the University Tabriz (Iran) for six years. I was director of Thin Films and Advanced Solid State Physics Labs as well.

    In 2012 I joined Binghamton University to pursue my PhD in physics where I got a chance to work with the Universal Instruments AREA Consortium. My research is related to solid state interfacial reactions of standard operating temperature alloys in high temperature environments to determine their feasibility in high temperature applications.

  • Shuai_Shao

  • Shuai Shao
    Binghamton University Graduate Research Associate
    Graduate Department: Mechanical Engineering
    Faculty Adviser: Prof. Seungbae Park
    Universal Instruments Corporation Engineer Mentor: Dr. Babak Arfaei

    Shuai Shao is originally from P.R. China. He graduated with his Bachelor of Science (Mechanical Engineering) degree in University of Science and Technology of China. He received his Master of Science (Mechanical Engineering) degree from Binghamton University in 2012. He is pursuing Ph.D. degree. He started his research with Universal Instruments AREA Consortium in Jan 2014. His research is mainly related to drop test reliability and failure analysis, as well as thermo-mechanical simulation work.

  • Sai_Srinivas_Sriperumbudur

  • Sai Srinivas Sriperumbudur
    Rochester Institute of Technology Graduate Research Associate
    Graduate Department: Manufacturing and Mechanical Engineering Technology
    Faculty Adviser: Prof. Martin Anselm
    Universal Instruments Corporation Engineer Mentor: Michael Meilunas

    I am from Hyderabad, India. I earned my Bachelor’s degree from Vellore Institute of Technology, India. I am pursuing my Master’s degree in Manufacturing and Mechanical Systems Integration at Rochester Institute of Technology and I am working on my thesis related to “Correlating Solder Paste Deposit Variability to Solder Joint Reliability” at UIC.

Recently Graduated Students

  • Aaron_Stewart

  • Aaron Stewart
    Binghamton University Graduate Research Associate
    Department: Mechanical Engineering
    Faculty Advisor: Prof. Quang Su

    I am originally from Vestal, NY. I earned my Bachelor’s in Mechanical Engineering at Binghamton University in May 2013 and am currently pursuing my Master’s Degree (ME) where I work with Universal Instruments doing vibration testing and failure analysis on electronic assemblies.

  • Mohammad_Quran

  • Mohammad Quran
    Binghamton University Graduate Research Associate
    Graduate Department: Systems Science and Industrial Engineering
    Faculty Adviser: Prof. Peter Borgesen
    Universal Instruments Corporation Engineer Mentor: Dr. Pericles Kondos

    Mohammad is originally from Amman, Jordan. After earning his bachelor degree in Electrical and Computer Engineering from the Hashemite University (Jordan), he worked for one year as a IT & network officer at Samra wastewater treatment plant (Jordan), then worked for three years as a Computer Engineer at Jordan Nuclear Regulatory Commission (JNRC, Jordan). In January 2013 Mohammad started my Master’s degree in Industrial and Systems Engineering at Binghamton University. He is currently working with Universal Instruments’ on PCB board material comparison and the study of pad cratering location analysis (statistical analysis on how the glass bundles will influence the pad cratering performance), and working on the optimization of underfill process and material evaluation.

  • Sad_Hamasha

  • Sa’d Hamasha
    Ph.D. Candidate & Graduate Research Associate
    Graduate Department: Systems Science and Industrial Engineering
    Faculty Adviser: Prof. Peter Borgesen

    Sa’d Hamasha is a Ph.D. Candidate in the Department of Systems Science and Industrial Engineering at Binghamton University working on reliability modeling and analysis of advanced microelectronics components in the Borgesen Research Group. He received a M.S. in Industrial Engineering from Jordan University of Science and Technology in June, 2010, and a B.S. in Mechanical Engineering in June 2007 from the same university. His research is focused on the reliability of microelectronics assemblies under realistic service conditions.

    I am originally from Vestal, NY. I earned my Bachelor’s in Mechanical Engineering at Binghamton University in May 2013 and am currently pursuing my Master’s Degree (ME) where I work with Universal Instruments doing vibration testing and failure analysis on electronic assemblies.

  • Gaurang_Joshi

  • Gaurang Joshi
    Binghamton University Graduate Research Associate
    Graduate Department: Mechanical Engineering
    Faculty Adviser: Prof. James Pitarresi
    Universal Instruments Corporation Engineer Mentor: Michael Meilunas

    Originally from the city of Mumbai, India; I earned my Bachelor’s in Mechanical Engineering from the University of Mumbai. I came to Binghamton University to pursue my Master’s in Mechanical Engineering where I got a chance to work for Universal Instruments. I work mainly in the field of reliability testing and failure analysis. I am assisted by the superior guidance and expertise of Michael Meilunas and Martin Anselm.

  • Gil_Cohen

  • Gil Cohen
    Binghamton University Graduate Research Associate
    Graduate Department: Mechanical Engineering
    Faculty Advisor: Prof. James Pitarresi
    Universal Instruments Corporation Engineer Mentor: Dr. Martin Anselm

    Originally from White Plains, NY he completed his undergraduate degree at Binghamton University is now pursuing his master’s degree, both in Mechanical Engineering. Earlier this year, he began a research opportunity with Universal Instruments executing Finite Element Method for various test assemblies. Now with the help of Dr. Martin Anselm he is performing conformal evaluation studies on TB2013 assemblies while also analyzing samples that have failed in thermal cycling.

  • Mohammad_Gharaibeh

  • Mohammad Gharaibeh
    Binghamton University Graduate Research Associate
    Graduate Department: Mechanical Engineering
    Faculty Advisor: Prof. James Pitarresi
    Universal Instruments Corporation Engineer Mentor: Dr. Harry Schoeller

    I am originally from Jordan; I earned my B.Sc. and M.Sc. in Manufacturing Engineering and Mechanical Engineering from Jordan University of Science and Technology (Jordan) in 2009 and 2011, respectively. Currently, I am a Ph.D. student in the Mechanical Engineering Department at Binghamton University and working with Universal Instruments AREA Consortium. My research involves precise finite element modeling of printed circuit boards subjected to vibrations and shock/drop profiles. I pursue my work with AREA consortium and under supervision of Prof. Pitarresi in addressing challenging issues and methodologies in simulating electronic assemblies under mechanical loading.

  • Guillaume_Jaudeau

    From left: John DeSousa-HR Director, Guillaume Jaudeau, Jean-Luc Pelissier-CEO

  • Guillaume Jaudeau
    CESI (Industrial Higher Education Center) and Lacroix Electronics apprentice student
    Graduate Department: Electronics and Industrial Engineering
    Faculty Advisor: Ms. Isabelle Martinez
    Lacroix Electronics supervisor: M. Claude Floury

    I was born in Challans (France) and raised in Cholet (France). After earning my bachelor’s degree in Electronics Engineering from the University of Saint-Gabriel (France), I worked in Thalès Industry as a technician in electronics for one year and then in Lacroix Electronics (EMS Company) during one year.

    In 2011, I decided to come to CESI University (France) to pursue a master’s in apprentice in Industry engineering, with Lacroix Electronics (France) where I work on AOI machine. It gave me the chance to do an internship with Universal Instrument’s AREA Consortium, where I worked with Dr. Harry Schoeller on a TMV PoP solderability project.