Downloads & Resources

Component Underfill Manual

Update Submitted by: Harry Schoeller
Added to this version:

• Rework of Fine Pitch Components:
  • Rework and Re-ball process for 0.3mm CSP
  • Reliability of Reworked assemblies in ATC and drop testing
• Vapor Phase Rework:
  • Description of VP desoldering fixture
  • VP desoldering procedure