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Backward Compatible Assembly and Reliability

Downloads & Resources

Mixed Alloy Process Manual
Backward Compatible Fine Pitch CSP Build and Thermal Cycling With and Without Underfill (0.4mm & 0.5mm)
Mixed Solder Alloy Reliability
Effects of Solder Paste Volume and Reflow Profiles on the Thermal Cycling Performance of Mixed SnAgCu/SnPb Solder Joints
Effects of Cycling Parameters on the Thermal Fatigue Life of Mixed SnAgCu/SnPb Solder Joints
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