Backward Compatible Assembly and Reliability Downloads & Resources Mixed Alloy Process Manual Backward Compatible Fine Pitch CSP Build and Thermal Cycling With and Without Underfill (0.4mm & 0.5mm) Mixed Solder Alloy Reliability Effects of Solder Paste Volume and Reflow Profiles on the Thermal Cycling Performance of Mixed SnAgCu/SnPb Solder Joints Effects of Cycling Parameters on the Thermal Fatigue Life of Mixed SnAgCu/SnPb Solder Joints
