Backward Compatible Assembly and Reliability

Downloads & Resources

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[icon name=”download-alt” size=”small” style=”simple”][/icon] Mixed Alloy Process Manual

[icon name=”download-alt” size=”small” style=”simple”][/icon] Backward Compatible Fine Pitch CSP Build and Thermal Cycling With and Without Underfill (0.4mm & 0.5mm)

[icon name=”download-alt” size=”small” style=”simple”][/icon] Mixed Solder Alloy Reliability

[icon name=”download-alt” size=”small” style=”simple”][/icon] Effects of Solder Paste Volume and Reflow Profiles on the Thermal Cycling Performance of Mixed SnAgCu/SnPb Solder Joints

[icon name=”download-alt” size=”small” style=”simple”][/icon] Effects of Cycling Parameters on the Thermal Fatigue Life of Mixed SnAgCu/SnPb Solder Joints