2019 Meetings Downloads & Resources October | May | March October Agenda October AREA Introduction: Jim Wilcox June Agenda May AREA Introduction: Jim Wilcox March Agenda March AREA Introduction: Jim Wilcox MAT6H. Sintered Copper Joining: Peter McClure MAT7F. Low-Melt BiSn Mixed Assembly: Effect of Reflow Temperature: Eric Cotts MAT7F. Low-Melt BiSn Mixed Assembly: Mechanical and Microstructural Behavior: Luke Wentlent REL9A. Mixed VIPPO BGA Array Soldering Defects: Pericles Kondos and Thaer Alghou REL18A. BiSn Mixed Solder Electromigration: Faramarz Hadian, Mohammed Genanu, Eric Cott Power Packaging Assembly Challenges: Douglas Hopkin MAT1C. Capillary Underfill and Edge Bonding of BGA Components: Pericles Kondos and Thaer Alghoul MAT6G. High Reliability Solder Alloys: Effect of Bi Content: Luke Wentlent MAT4C. Thermal Interface Materials: Thermal Mechanical Cycling: Michael Gaynes and Peter McClure MAT9B. Self Assembly Paste Evaluation SAP Overall – 8X video: Peter McClure and Yujia Wang REL11B. Modeling of BGA Applications under Tensile Load: Michael Meilunas and Mahdi Farahikia REL15C. Power Cycle Reliability Testing (PBGA, QFN): Michael Gaynes, et al APD8A. Solder Voiding Behavior in Vacuum Reflow Soldering Vacuum Reflow video: Michael Meilunas MAT6C. Sintered Silver Printing and Die Attach Study: Thaer Alghoul and Pericles Kondos MAT4B. Thermal Interface Resistance: Surface Roughness Effects: Peter McClure and Michael Gaynes APD11C. Selected Area Laser Rework: Luke Wentlent