2018 Meetings Downloads & Resources October | May | March October Agenda October AREA Introduction: Jim Wilcox REL15C: Power Cycle Testing: Michael Gaynes APD2B: Flexible Substrate Chip Joining: Peter McClure, Mukund Ayalasomayajula MAT8D: Conformal Coating for Mitigation of Sulfur Induced Resistor Corrosion: Marie Cole, et al. MAT7F: Low-Melt BiSn Mixed Solder Assembly: Luke Wentlent REL18A: Electromigration Behavior of BiSn Mixed Solder Joints: Faramarz Hadian Packaging Challenges for SiC Power Semiconductors: Arun Gowda APD8A: In-line Vacuum Reflow SMT Process: Michael Meilunas, Arvind Karthikeyan APD11B: Laser Reflow Die Stacking: Luke Wentlent REL9A: Mixed VIPPO Array Solder Joint Defects: Pericles Kondos REL5B: Screening the PCB Microvia Reliability Problem: Kevin Knadle MAT6C: Sintered Silver Die Attach Materials Update: Pericles Kondos MAT4B,C: Thermal Interface Materials (TIM2): Performance & Reliability: Michael Gaynes, Mukund Ayalasomayajula MAT6G: Pb-free Solder Alloys for Engine Control Applications: Michael Meilunas MAT9B: Self Assembly Paste Evaluation SAP consolidation video – 8X (pg. 7): Peter McClure Effect of Precipitate Coarsening on Solder Joint Life in Test and Use: Thaer Alghoul, Peter Borgesen APD2B: Ultra-thin Wafer Die Ejection from Tape: Peter McClure, Preeth Sivakumar June Agenda May AREA Introduction: Jim Wilcox Sintered Silver Bonding Studies: Pericles Kondos (presented by J. Wilcox) Pb-free Solder Alloy Evaluations: Luke Wentlent Thermal Interface Materials: Performance & Reliability: Michael Gaynes (presented by J. Wilcox) System in Package (SiP) Interconnect Reliability: Michael Meilunas (presented by J. Wilcox Area Selective Laser Reflow Assembly: Luke Wentlent Flexible Electronics Substrate Assembly: Peter McClure (presented by L. Wentlent) Mixed VIPPO Array Soldering Defects: Pericles Kondos (presented by J. Wilcox) March Agenda March AREA Introduction: Jim Wilcox APD2B. Flexible Substrate Chip Joining: Peter McClure APD2C. SnAgCu Soldering to Conductive Ink Circuitry: Peter McClure MAT6G. Solder Alloys for Engine Control Applications: Luke Wentlent PCB Hole Fill Process Capability Study: Anjani Ladhar REL9A. Mixed VIPPO Array BGA Soldering Defects: Pericles Kondos MAT7F. Low Temperature Mixed Solder Assembly: Mechanical Characterization: Peter Borgesen MAT7F. Low Temperature Mixed Solder Assembly: High Strain Rate Fragility: Luke Wentlent MAT4D. High Performance Die Level Thermal Interface Materials: Divya Choudhary REL17A. System in Package Interconnect Reliability – SAC305: Michael Meilunas AREA Research Portfolio Briefs – March 2018: Michael Meilunas, Pericles Kondos, Michael Gaynes IPC Assembly Specification Updates: Brook Sandy-Smith Conformal Coating for Sn Whisker Mitigation: Fei Dong MAT8B. Conformal Coating Thermal Cycle Reliability Impact: Michael Meilunas MAT8D. Conformal Coating for Mitigation of S Induced Resistor Corrosion: Marie Cole REL15C. Power Cycle Reliability Testing: Michael Gaynes APD11B. Laser Selective Reflow Assembly and Reliability: Luke Wentlent APD11C. Laser Rework Station Development: Brian Sohn