2009 Meetings Downloads & Resources March | June | October March Presentations Fatigue of low-Ag solder joints Thermal cycling of lead free solders Empirical modeling of thermal cycling test results Crack initiation and growth in lead free solder joints during thermal cycling and cyclic bending, including the potential for much faster life prediction Lead free solder microstructure Quantitative understanding of recrystallization and consequences for lead free life assessment Materials Results and models for the effects of varying loads on lead free fatigue (Miner’s rule) Tutorial on the mechanisms and complications of solder pad cratering A serious risk of pad cratering is universally overlooked Cratering and solder failure for different SAC alloys in drop and cyclic impact (pendulum) testing Printing of solder paste for 0.4mm pitch area array assembly manufacturing Intermetallic bonds to ENEPIG and Ni/Au pad finishes Performance of underfills and edge bonds in drop testing Voiding in Cu3Sn Characterization of Thermal Interfaces Precommercial TIM Process Development and Reliability Evaluation Thermal Tape Characterization June Presentations Reliability Investigation of SN100C: Phase II Lead Free Thermal Cycling Progress Failure Analysis Pad Cratering Test Methods Recrystallization of SAC Solder Joints in Thermal Cycling Accelerated Aging of Lead-Free SolderJoints Effects of Different Load Combinations on Pb-Free Solder JointsSn Reflowing Low-Ag(+X) Joints Lead Free Solder Joint Reliability The Manhattan Project Sporadic Failure of Solder Joints on Ni/Au Pads Thermal Bondline Assembly Rapid Ranking and Screening Procedures for Underfills and Corner/Edge Bonds October Presentations Thermal Cycling Update Neural Network Analysis of Thermal Cycling Data Pad Cratering Pad Crater Testing New Thermal Interface Materials Reliability of Thermal Interface Materials Spalling in Lead Free Solder Joints Microstructure of Low-Ag Alloys Soldering with Low-Ag Alloys Damage Accumulation Under Variable Loads Damage Accumulation and Microstructure Microstructure Evolution in SnAgCu Solder Joints Edge and Corner Bonding Testing for IMC Issues on Ni Pads Flux Dipping Reballing ENEPIG Consortium Reports
