2008 Meetings Downloads & Resources June 2008 | October 2008 | March 2009 June 2008 Presentations Electronics Packaging for Military and Aerospace Brittle Failure and Spalling on Ni/Au How to Prevent Voiding Sn and Other Metal Whiskers Thermal Cycling of Lead-Free Solders ‘Bump’ and RecrystallizationSn Thermal Cycling Test ProtocolSn Effects of Dwell in Isothermal Fatigue Testing Comparison of Pad and Board Level Testing Development of Micro-Impact Fatigue Testing Thermal Interface Materials Interconnect Stress Testing Results Nelco Laminate Roadmap Pad Cratering in Area Array Repair The Role of Glass Fibers in Pad Cratering Fine Pitch Flip Chip Assembly/Au October 2008 Presentations Update on Voiding in Cu3 A Case Study of Sproadic Brittle Failure on Ni/Au Surface Finish Brittle Failures on Ni/Au Finishes: Part II Package-on-Package Assembly and Reliability Investigation Vibration Test Results Lead Free Thermal Cycling Progress< “High Density” Reliability Test Pb-Free Laminate Testing and Recommendations Pad Cratering UpdateSn: An Update CAF Response to Mechanical Loading PCB Damage in Area Array Repair: Week 41 Update Controlling the Rework Profile Thermal Interface Bondline Assembly Quantitative Acceleration of Long-Term Agin Microstructure Evolution in Pb-Free Solder Alloys During Isothermal Aging Microstructure Evolution in Pb-Free Solder Alloys During Thermal Cycling Solar Panel Technology Paste/Underfill Compatibility Update Underfill Flow Studies Mechanical Test of Edge and Corner Bond Assemblies Underfill and Solder Joint Loading in Thermal Cycling March 2009 Presentations Drop Testing Update Thermal Cycling Update Thermal Cycling Induced Microstructure Evolution in Lead Free Solder Cycling Induced Recrystallization of Lead Free Solder and Why You Should Care Acceleration of Long Term Aging Effects in Lead Free Solder The Complete Breakdown of Miner’s Rule in Load Controlled Cycling of No-Pb Solder On the Breakdown of Miner’s Rule for Lead Free Solder Vibration Testing of Multiple Alloys & Pad Finishes Thermal Interface Materials Electrolytic Cu Plating Recommendations The Nature of Pad Cratering PCB Cook Book Update & Halogen Free PCB Plans Digital Human Modeling Technology: Overview, Opportunities, and Applications Component Underfill Cook Book Adhesion/Cohesion Testing of Underfills and Corner/Edge Bonding Materials Drop Testing of Corner/Edge Bonded Assemblies Lead Free Rework Area Array Repair Cook Book
