2008 Meetings

Downloads & Resources

June 2008  |  October 2008  |  March 2009
June 2008 Presentations
Electronics Packaging for Military and Aerospace
Brittle Failure and Spalling on Ni/Au
How to Prevent Voiding
Sn and Other Metal Whiskers
Thermal Cycling of Lead-Free Solders
‘Bump’ and RecrystallizationSn
Thermal Cycling Test ProtocolSn
Effects of Dwell in Isothermal Fatigue Testing
Comparison of Pad and Board Level Testing
Development of Micro-Impact Fatigue Testing
Thermal Interface Materials
Interconnect Stress Testing Results
Nelco Laminate Roadmap
Pad Cratering in Area Array Repair
The Role of Glass Fibers in Pad Cratering
Fine Pitch Flip Chip Assembly/Au
October 2008 Presentations
Update on Voiding in Cu3
A Case Study of Sproadic Brittle Failure on Ni/Au Surface Finish
Brittle Failures on Ni/Au Finishes: Part II
Package-on-Package Assembly and Reliability Investigation
Vibration Test Results
Lead Free Thermal Cycling Progress<
“High Density” Reliability Test
Pb-Free Laminate Testing and Recommendations
Pad Cratering UpdateSn: An Update
CAF Response to Mechanical Loading
PCB Damage in Area Array Repair: Week 41 Update
Controlling the Rework Profile
Thermal Interface Bondline Assembly
Quantitative Acceleration of Long-Term Agin
Microstructure Evolution in Pb-Free Solder Alloys During Isothermal Aging
Microstructure Evolution in Pb-Free Solder Alloys During Thermal Cycling
Solar Panel Technology
Paste/Underfill Compatibility Update
Underfill Flow Studies
Mechanical Test of Edge and Corner Bond Assemblies
Underfill and Solder Joint Loading in Thermal Cycling
March 2009 Presentations
Drop Testing Update
Thermal Cycling Update
Thermal Cycling Induced Microstructure Evolution in Lead Free Solder
Cycling Induced Recrystallization of Lead Free Solder and Why You Should Care
Acceleration of Long Term Aging Effects in Lead Free Solder
The Complete Breakdown of Miner’s Rule in Load Controlled Cycling of No-Pb Solder
On the Breakdown of Miner’s Rule for Lead Free Solder
Vibration Testing of Multiple Alloys & Pad Finishes
Thermal Interface Materials
Electrolytic Cu Plating Recommendations
The Nature of Pad Cratering
PCB Cook Book Update & Halogen Free PCB Plans
Digital Human Modeling Technology: Overview, Opportunities, and Applications
Component Underfill Cook Book
Adhesion/Cohesion Testing of Underfills and Corner/Edge Bonding Materials
Drop Testing of Corner/Edge Bonded Assemblies
Lead Free Rework
Area Array Repair Cook Book