2007 Meetings Downloads & Resources June 2007 | October 2007 | March 2008 June 2007 Presentations QFN Process Development and Reliability Project On the Behavior of Bubbles in Liquids Voiding in Paste-Only Solder Deposits Component Underfills Package-on-Package Voiding in Cu3Sn Copper Electroplating and Voiding in Cu3Sn Effects of Microstructure on Lead Free Solder Joint Reliability Lead Free Solder Joint Fatigue Study Pb-Free Thermal Cycle Testing Overview Challenges in Thermal Cycling of Lead Free Solders FCBGA Thermal Cycling Project Lead Free HASL Project Update 2008 Plans? Pad Cratering Update Missing Ball and Other Brittle Failures on Ni/Au Effects of Au on Brittle Failures in Assemblies on Electrolytic Ni/Au Investigations of Brittle Failure of IMCs on ENIG Underfill for Lead Free Flip Chips Reballing Lead Free Components with SnPb October 2007 Presentations Advanced Process Laboratory: Process Research and Support Lead Free PCB Projects Update Lead Free HASL Pad Cratering: Correlations Between Joint Level and Board Level Testing High Speed Bond Testing CSP Underfill and Edge/Corner Bonding Studies Intermetallic Formation in the Sn-Cu-Ni System Brittle Failures of Joints on Electrolytic Ni/Au Copper Electroplating and Voiding in Cu3Sn: An Update Preconditioning of Lead Free Solder Joints Solder Joint Strain Analysis Thermal Cycling of Lead-Free Solder Thermal Bondline Assembly TIM Studies Lead Free FC Thermal Cycling Parameters Effects of Solder Microstructure on Fatigue Reliability Test Plans & Schedule Solder Paste Selection for QFN Assembly Component Characterization Redressing Repair A Rework Process for LGA Components March 2008 Presentations Advanced Process Laboratory/AREA Consortium Pb Free Solder Alloy Reliability Update Mixed Solder Alloy Reliability Update Voiding in Cu3Sn: Why it is Sporadic? Solder Joint Strain Analysis Fine Pitch Flip Chip and TSV Based Die Stacking Pad Cratering:Relating Pad-Level Testing to Board Level Reliability Intermetallic Bonds to Ni/Au Pads CSP Underfill and Edge/Corner Bonding Studies Lead Free PCB Projects Update Cycling Results for Pb-Free Flip Chips with 8 Underfills Thermal Cycling Test Protocols for Lead-Free Solder APLWeb Online Registration and Tools Relationships between Drop Reliability and Energy Ongoing and Future Repair Projects Thermal Cycling Test Protocols for Lead-Free Solder Correlations Between Microstructure and Fatigue Life in Pb Free Solder Effect of Reflow Profile on Sn Undercooling and Microstructure Evolution in Sn-3.5Ag and Sn-3.9Ag-0.6Cu Lead Free Alloys Thermal Interface Bondline Assembly Void nucleation, Growth and Shrinkage in SAC405/Electrodeposited Cu Foil Solder Joints 2007 Master Report List (Excel file)