2004 Meetings

Downloads & Resources

June 2004  |  October 2004  |  March 2005
June 2004 Presentations
BGA Underfilling
BGA Underfill Analysis
ENIG Pad Finish Studies 
Effect of Component Weight on Double-Sided No-Pb Assembly
Analysis of Early Failures Among Fine Pitch CSP Assemblies
Effects of Reflow Ambient and Paste Printing on Reliability of No-Pb Fine Pitch Assemblies
Effect of PCB Immersion Silver Thickness on 2nd Level Reliability
Introduction to the Sekisui Micropearl SOL
Mechanical cycling and Failure Analysis of Mixed Solder CSP Assemblies (I)
Mechanical cycling and Failure Analysis of Mixed Solder CSP Assemblies (II)
MLF Assembly and Reliability
Solder Joint Reliability as a Function of Ag % (& Cu %)
Rework Cookbook Development
Effect of Temperature Ramp Rate on 2nd Level Reliability
Gold Bumped Flip Chip Assembly
Gold Bumped Flip Chip Assembly (Part II)
Flip Chip Reliability After Aging
No-flow Flip Chip Assembly on Flex – Substrate Issues
Flip Chip Reliability Test Results
Framing the Process Window: Optimizing Thermal Interface Assembly
Codification Software: Placement Yield Module
October 2004 Presentations
BGA Underfilling
Pb-free Chip Cap Failure
Influence of Composition and Cooling Rate on the Microstructure of Sn-Ag-Cu Solder Alloys
Kirkendall Voiding in Cu Pads and Other Pad Issues
Effects of Reflow Parameters and “Memory” on Pb-Free Solder Joint Microstructure
Concerns with Mixing Sn/Pb and Pb-Free Solders
Summary: Fragility of SAC Joints
PCB Damage in Pb-Free Reflow and Rework
PCB Cu Plating Anomalies and Thermal Failure Mechanisms
Assembly with No-Clean Polymer Flux (NPF)
Profiling Issues in Lead-Free Rework
Update: Rework Cook-Book
Effect of Thermal Cycle Dwell Time on 2nd Level Reliability
Flip Chip Reliability after Aging
Au-bumped Flip Chip
Board Design Issues for Flip Chip
Gold Bump FC
Moisture/Reflow Testing
Soldering Evaluation of New Flip Chip Fluxes
RFID Project
Assembly with Thermal Interface Materials
CALCEPWA Reliability Prediction Software
March 2005 Presentations
Alternate QFP Surface Finishes
Ball and Polymer Collar Attach to Fine Pitch CSP With Kester 9690 No-clean Polymer Flux
BGA Underfilling
Copper Structures and Pad Evaluation
Cu Consumption Study
Effects of Thermal Cycle Dwell Time on 2nd Level Reliability
Influence of Composition and Cooling Rate on the Microstructure of SnAgCu Solder Alloys
Lead Free Assembly — Board Damage Assessment
Lead-Free Reflow: Board Damage and Thermal Analysis Correlations
Lead-free Rework Guide
Lead-free Rework Issues
Mixed Assembly Reliability
Mixed SnAgCu/SnPb Solder Joints
SAC Fragility – Intermetallic Growth
SAC Fragility – Introduction
SAC Fragility – Speculation
Sekisui Micropearl SOL (Resin Bump)
SIMS Analysis, ‘Good’ & ‘Bad’ Cu
Surface Mount Capacitor Reliability After Lead-free Assembly
The Behavior of Voids in Cu-Sn
Where Do Voids Form and Grow?
Flip Chip Reliability Experiments
Gold Bump Flip Chip
Reflow Encapsulant Reliability
Thin Flip Chip BGA Project
Improving Thermal Interface Bondlines