2004 Meetings Downloads & Resources June 2004 | October 2004 | March 2005 June 2004 Presentations BGA Underfilling BGA Underfill Analysis ENIG Pad Finish Studies Effect of Component Weight on Double-Sided No-Pb Assembly Analysis of Early Failures Among Fine Pitch CSP Assemblies Effects of Reflow Ambient and Paste Printing on Reliability of No-Pb Fine Pitch Assemblies Effect of PCB Immersion Silver Thickness on 2nd Level Reliability Introduction to the Sekisui Micropearl SOL Mechanical cycling and Failure Analysis of Mixed Solder CSP Assemblies (I) Mechanical cycling and Failure Analysis of Mixed Solder CSP Assemblies (II) MLF Assembly and Reliability Solder Joint Reliability as a Function of Ag % (& Cu %) Rework Cookbook Development Effect of Temperature Ramp Rate on 2nd Level Reliability Gold Bumped Flip Chip Assembly Gold Bumped Flip Chip Assembly (Part II) Flip Chip Reliability After Aging No-flow Flip Chip Assembly on Flex – Substrate Issues Flip Chip Reliability Test Results Framing the Process Window: Optimizing Thermal Interface Assembly Codification Software: Placement Yield Module October 2004 Presentations BGA Underfilling Pb-free Chip Cap Failure Influence of Composition and Cooling Rate on the Microstructure of Sn-Ag-Cu Solder Alloys Kirkendall Voiding in Cu Pads and Other Pad Issues Effects of Reflow Parameters and “Memory” on Pb-Free Solder Joint Microstructure Concerns with Mixing Sn/Pb and Pb-Free Solders Summary: Fragility of SAC Joints PCB Damage in Pb-Free Reflow and Rework PCB Cu Plating Anomalies and Thermal Failure Mechanisms Assembly with No-Clean Polymer Flux (NPF) Profiling Issues in Lead-Free Rework Update: Rework Cook-Book Effect of Thermal Cycle Dwell Time on 2nd Level Reliability Flip Chip Reliability after Aging Au-bumped Flip Chip Board Design Issues for Flip Chip Gold Bump FC Moisture/Reflow Testing Soldering Evaluation of New Flip Chip Fluxes RFID Project Assembly with Thermal Interface Materials CALCEPWA Reliability Prediction Software March 2005 Presentations Alternate QFP Surface Finishes Ball and Polymer Collar Attach to Fine Pitch CSP With Kester 9690 No-clean Polymer Flux BGA Underfilling Copper Structures and Pad Evaluation Cu Consumption Study Effects of Thermal Cycle Dwell Time on 2nd Level Reliability Influence of Composition and Cooling Rate on the Microstructure of SnAgCu Solder Alloys Lead Free Assembly — Board Damage Assessment Lead-Free Reflow: Board Damage and Thermal Analysis Correlations Lead-free Rework Guide Lead-free Rework Issues Mixed Assembly Reliability Mixed SnAgCu/SnPb Solder Joints SAC Fragility – Intermetallic Growth SAC Fragility – Introduction SAC Fragility – Speculation Sekisui Micropearl SOL (Resin Bump) SIMS Analysis, ‘Good’ & ‘Bad’ Cu Surface Mount Capacitor Reliability After Lead-free Assembly The Behavior of Voids in Cu-Sn Where Do Voids Form and Grow? Flip Chip Reliability Experiments Gold Bump Flip Chip Reflow Encapsulant Reliability Thin Flip Chip BGA Project Improving Thermal Interface Bondlines
