2003 Meetings Downloads & Resources June 2003 | October 2003 | March 2004 June 2003 Presentations Microstructure of Mixed Tin-Lead / No-Lead Solder Joints “Mixed” CSP and BGA Reliability 0.4 mm Pitch CSP Printing 0.4 mm Pitch CSP Assembly & Reliability Solder Joint Bridging in 0.4 mm Pitch CSP Assembly Soldering to Electroless Ni/Immersion Au – The “Black Pad” Failure Mechanism 2nd Level Reliability Update Underfilling by Stencil Printing Room Temperature Underfilling The Most Promising Underfills Package Underfilling High Temperature JEDEC Level 3 Moisture/Reflow Sensitivity Testing Progress on Assembly of Au-Bumped Flip Chips to Solder Bumped Substrates Effects of Electromigration in No-Pb Flip Chip Assemblies Reliability Effects of Thermal Excursions and Thermal Aging on SAC-Bumped Flip Chips No-Lead Flip Chip Joint Microstructure Effects of Thermal History and Process Variables Pb-Free Reflow Encapsulants Lid Attach A New Generation of Thermal Interface Materials; An Analytical and Experimental Study Application of Thermal Interface Materials by Stencil Printing Printing & Dispensing of Thermal Interface Material – An Initial Comparison Evolution of Voids in Thermal Interface Material During Cure Characterization of Thermal Interface Materials October 2003 Presentations Reliability of mixed SnPb/no-Pb solder joints Microstructure evolution in mixed SnPb/no-Pb solder joints Ag concentrations Immersion Ag pad finishes — variability and assembly Reliability of area array assemblies on immersion Ag pad finishes CSP underfilling by stencil printing 2nd Level reliability update Squeegee based and pressure enhanced solder paste printing 0.4mm pitch CSP assembly 0.4mm pitch CSP rework and reliability Materials for manufacturing in China – Preliminary PCB studies Assembly of Au stud bumped flip chip No-Pb flip chip assembly & reliability Effects of cycling and aging on no-Pb flip chip solder joint microstructure Effects of electromigration and aging on flip chip assemblies Reliability of SnPb based flip chip assemblies with no-flow underfills No-Pb flip chip assembly with, and reliability of,no-flow underfill Flip chip technology transfer High power component assembly onto heat sinks – Thermal interface materials and process issues Heat sink attach to PBGA assemblies – Process and automation issues March 2004 Presentations Metallurgy of Mixed No-Pb/SnPb Solder Joints Mixed SnPb/no-Pb Soldering: Preliminary Recommendations Effects of PCB Surface Finish on the Reliability of Area Array Packages Fine-Pitch CSP Rework and Reliability Pb-Free Area Array Reliability Update Mixed Alloy Reliability (AATC) 2003 Sn-Ag-Cu Joint Inspection and Failure Analysis Thermal Cycling Resistance of 0.4mm Pitch WLCSP Assemblies With Mixed Solder Joints Lead Free Wave Soldering Process Reliability Effects of Rework Induced Lead/No-Lead Solder Alloy Mixing AATC Reliability and Lead Pull Testing SnPb Based 0.4 mm Pitch WLCSP Assembly & Reliability Area Array Sn/Pb Solder Joint Reliability Year End Wrap-Up Mixed Hybrid Assemblie: NanoSphere Wafer Scale Package Thermal Cycling Resistance of SnAgCu Based WLCSP Assemblies Reflow Encapsulant Manual Update on Pb-Free JEDEC Level 3 Moisture/Reflow Sensitivity Testing Flip Chip Assembly Manual Effects of High Temperature Aging on Thermal Cycling Resistance of LF2 Based Flip Chip Assemblies Pb-Free Flip Chip Assembly Gold Stud Bumped Flip Chip Assembly The Most Promising Underfills Flip Chip Underfilling By Stencil Printing Underfill Manual Sn-Ag-Cu Joint Inspection and Failure Analysis Flip Chip Reliability and Test Protocols No-Pb Flip Chip Assembly and Reliability with Reflow Encapsulants Minimizing Thermal Resistance Heat Sink Attach to PBGA Assemblies Lid Attach Deposition & Curing of Thermal Interface Materials Process-Induced Filler Particle Separation in Thermal Interface Materials Codification Software
