2002 Meetings

Downloads & Resources

June 2002  |  October 2002  |  March 2003
June 2002 Presentations
Area Array Research Consortium
Lead-Free Soldering Programupdate On Flip Chip Activities In The Area Array 2002 Consortium
Flip Chip Reliability – A Brief Review
Underfill Comparisons In Air-To-Air Cycling And Liquid Shock
Accelerated Testing Of Flip Chip Underfill – Sensitivity To Aging/Moisture – An Update
Jet Dispensing Of No-Clean Liquid Fluxes For Flip Chip Assembly
Lead-Free Pbga Reliability
Area Array Research Consortium Lead-Free Soldering Program Summary
Lead Free Bga Aatc Reliability
Comparison Of Pb-Free Solder On Uic Test Boards And Components
October 2002 Presentations
Flip Chip Program Update
Flip Chip Results High Temp Jedec Level 3 Testing, Molded Flip Chip & Flip Chip On Flex
Flip Chip Assembly In Air And Reliability
Jet Dispensing Of Liquid Fluxes For Flip Chip Assembly
Pb-Free Flip Chip Assembly
Pb-Free Flip Chip Reliability
Packaging Passives And Passing Telcordia
Area Array 2002 Consortium Presentation Immersion Silver Pcb Finish
Evaluation Of Underfilling Methods For Csp Assemblies
Flux Only Assembly Of Wafer Level Chip Scale Packages
Qfp Assembly & Lead Pull Study (Alternate Surface Finishes)
Lead Free Testing Update
Area Array Reliability Update
Minimization Of Damage To Optical Fibers During Cleaving, Stripping, And Splicing
On The Loss Of Mass From Optical Adhesives Before, During, And After Cure
Pin Transfer Of Adhesives
Codification Software
Alternate Surface Finishes – Assembly And Reliability Updates
Reliability Of Double-Sided Assemblies
March 2003 Presentations
Pb-Free Flip Chip Assembly & Reliability
Pb-Free Metallurgy Design And Process Issues
Flip Chip Assembly In Air And Reliability
Flux Jetting Process Development And No-Clean Liquid Flux Evaluation
Transfer Molding Of Flip Chips
First-Level Assembly And Reliability Of An Overmolded Flip Chip Csp
Flip Chip On Flex
Reliability Comparison Of 15 Underfills
Reliability Testing: What Are We Missing?
High Temperature Jedec Level 3 Moisture/Reflow Sensitivity Testing
Overview Of 2577 I/O, 52.5 Mm Hyperbga Assembly, Rework, And Reliability Project
Flux Only Assembly Of Wafer Level Chip Scale Packages
Optical Fiber Test Interpretation
Area Array Reliability Overview 2002
Qfp Assembly & Lead Pull Study (Alternate Surface Finishes)
Optoelectronics Packaging 2002
Assembly & Test Of Csps On Flex Pcbs
Pin Transfer And Dispensing Of Very Small Adhesive Volumes
Codification Software – 2003
Updates In Codification Software – 2003
Alternate Surface Finishes – Solderability, Assembly & Reliability
Reliability Of Double-Sided Assemblies