Innova Direct Die Feeders support a full complement of high-volume flip chip and bare die applications. Innova enables high-speed die delivery from wafer over a wide range of die sizes. When integrated with the flexible FuzionSC Platform, Innova eliminates the need for dedicated die presentation systems to streamline processes and improve efficiency.
- Ideal for SiP applications
- High-mix to high-volume support
- Handles up to 300mm wafers
- Inline barcode scanning supports ALPs or Inkless wafer maps
- Supports up to 4 per machine
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