Innova Direct Die Feeder

[two_fifth valign=”top” animation=”none”]



[three_fifth_last valign=”middle” animation=”none”]

Innova Direct Die Feeders support a full complement of high-volume flip chip and bare die applications. Innova enables high-speed die delivery from wafer over a wide range of die sizes. When integrated with the flexible FuzionSC Platform, Innova eliminates the need for dedicated die presentation systems to streamline processes and improve efficiency.

  • Ideal for SiP applications
  • High-mix to high-volume support
  • Handles up to 300mm wafers
  • Inline barcode scanning supports ALPs or Inkless wafer maps
  • Supports up to 4 per machine

[space value=”20″]



[space value=”-5″]


[toggle title=”Innova Models & Specifications” state=”off” style=”solid” icon=”info-sign”]

  • Innova – High-speed flip chip and bare die presentation from a single wafer
  • Innova + – High-speed flip chip and bare die presentation with a cassette supporting up to 13 wafers

[uic-tbl id=5][/uic-tbl]


[divider style=”none”]


[space value=”-10″]


Downloads & Resources

[space value=”7″]


[space value=”20″]