Innova Direct Die Feeder

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Innova Direct Die Feeders support a full complement of high-volume flip chip and bare die applications. Innova enables high-speed die delivery from wafer over a wide range of die sizes. When integrated with the flexible FuzionSC Platform, Innova eliminates the need for dedicated die presentation systems to streamline processes and improve efficiency.

• Ideal for SiP applications
• High-mix to high-volume support
• Handles up to 300mm wafers
• Inline barcode scanning supports ALPs or Inkless wafer maps
• Supports up to 4 per machine

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• Innova – High-speed flip chip and bare die presentation from a single wafer
• Innova + – High-speed flip chip and bare die presentation with a cassette supporting up to 13 wafers

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