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FuzionSC Platform
FuzionSC is Universal Instruments’ next-generation semiconductor platform, offering the industry’s most precise accuracy, highest flip chip throughput, and widest component range.
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Innova Direct Die Feeder
Embrace the convergence era of electronics assembly with the Innova and Innova + direct die feeders. This revolutionary technology enables the presentation of wafer-level devices to Universal’s FuzionSC Platform without incurring costly packaging charges.
