Advanced Packaging


FuzionSC Platform

FuzionSC is Universal Instruments’ next-generation semiconductor platform, offering the industry’s most precise accuracy, highest flip chip throughput, and widest component range.


Innova Direct Die Feeder

Embrace the convergence era of electronics assembly with the Innova and Innova + direct die feeders. This revolutionary technology enables the presentation of wafer-level devices to Universal’s FuzionSC Platform without incurring costly packaging charges.