Advanced Packaging

  • FuzionSC_Platform

    FuzionSC Platform

    FuzionSC is Universal Instruments’ next-generation semiconductor platform, offering the industry’s most precise accuracy, highest flip chip throughput, and widest component range.

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  • Innova_feeder

    Innova Direct Die Feeder

    Embrace the convergence era of electronics assembly with the Innova and Innova + direct die feeders. This revolutionary technology enables the presentation of wafer-level devices to Universal’s FuzionSC Platform without incurring costly packaging charges.

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