Advanced Packaging

FuzionSC_Platform

FuzionSC Platform

FuzionSC is Universal Instruments’ next-generation semiconductor platform, offering the industry’s most precise accuracy, highest flip chip throughput, and widest component range.

Innova_feeder

Innova Direct Die Feeder

Embrace the convergence era of electronics assembly with the Innova and Innova + direct die feeders. This revolutionary technology enables the presentation of wafer-level devices to Universal’s FuzionSC Platform without incurring costly packaging charges.