Advanced Packaging

Advanced Packaging Examples
  • Wafer
  • Flip Chip Test Board
  • Die Attach (QFN/SOIC)
  • Lead Frame (Automotive Sensor)
  • System-in-Package (RXTX Module)
  • Flip Chip on Flex (Hard-Drive)
  • Package-on-Package (PoP)
  • Flip Chip Reliability Test Board
  • System-in-Package (SIP) on Micro BGA
  • Flip Chip Module (Micro Processor)

http://www.uic.com/solutions/advanced-packaging/