AREA consortium assembly research is executed for the benefit of our member companies with all results and supporting data archived for on-demand access by the membership. Key observations are routinely selected from this growing archive for sharing with the industry at large. Recent examples include the following topics presented at the 2018 SMTA International conference:
Session HE1. Predicting Component Life for Harsh Environments
Pam Lembke: Testing and Mitigating Resistor Silver Sulfide Corrosion
Session APT4. Board Level Reliability
Reza Ghaffarian: Characterization of SiP Assembly and Reliability under Thermal Cycles
Session LF2. High Reliability Pb-free Alloys, SAC305 and Beyond
Lars Bruno: Effect of TIM Compression Load on BGA Reliability
Thank you to these APL industry collaborators for being the public face of our consortium and making these valued contributions to the industry literature.