UIC’s Advanced Process Laboratory (APL) worked in collaboration with the global leader in IVUS catheter to define and develop an assembly process capable of producing these challenging devices in a cost-effective manner.
The abstract of a paper recently presented at SMTA Dallas by Universal Instruments’ Advanced Process Lab.
Have you ever looked at a computer motherboard, seen mostly surface mounted components and wondered why the designers chose to use leaded electrolytic capacitors in their design?
Universal Instruments’ proprietary Topside Alignment Placement (TAP) process aligns placement based on top features, enabling high accuracy placement for a wide range of applications.
Universal Instruments views customer training as one of the most critical services we provide to customers and is proud to offer best-in-class training at our global facilities.
Low force method using LMR (Low Mass Redesign) spindle assemblies.
With so many placement head design concepts available, how do you tell which one is the best? The answer lies in the anatomy of the placement head. Whether it’s rotary, inline, small or large, each has its unique characteristics.
CFL and LED lighting are helping to increase the demand for new radial through-hole equipment.
Imagine for example, combining active die components, WLCSPs, uBGAs and passive SMDs with its interconnecting media such as solder paste and flux into a substrate. It will require series of processes that could consume certain length of time and multiple equipment utilization before it can be completed.
You might ask, “What’s the difference between this nozzle and the older conical 0402 ceramic nozzle?” Simply put, we think this latest design is a far superior option. Here’s why…
Semiconductor packaging has traditionally followed dedicated equipment sets for given package formats or processes dictated by Bare Die or Flip Chip assembly. New package functionality, performance, miniaturization, low cost materials are driving the ever import Time to Market product life.