Universal Instruments is committed to working with its industry partners to drive towards a common goal and follow the most efficient path towards a smarter future.
The majority of people are not fully clear what Industry 4.0 is all about and afraid to make mistakes when implementing new manufacturing strategies. Many don’t seem to know where to start.
Industry 4.0 is the new buzzword. Everyone is talking about it, having visions of a promising future built around technology and connectivity.
Universal regularly embraces new technologies to fuel innovation and improve time to market for our customer-focused solutions.
Various feeding options to meet your assembly needs.
Ensure ESD safety during your manufacturing process and take steps towards eliminating ESD damage and issues with your PCB assembly process!
Polaris Junior Assembly Cell, streamlined, cost-effective, single-process assembly capability for light robotic and semi-automatic processes.
Same Cell – Several Applications
UIC’s Advanced Process Laboratory (APL) worked in collaboration with the global leader in IVUS catheter to define and develop an assembly process capable of producing these challenging devices in a cost-effective manner.
The abstract of a paper recently presented at SMTA Dallas by Universal Instruments’ Advanced Process Lab.
Have you ever looked at a computer motherboard, seen mostly surface mounted components and wondered why the designers chose to use leaded electrolytic capacitors in their design?
Universal Instruments’ proprietary Topside Alignment Placement (TAP) process aligns placement based on top features, enabling high accuracy placement for a wide range of applications.