APL Recognized by Cornell for Innovative Research

APL Recognized by Cornell for Innovative Research

At the close of each academic year, the Cornell Materials Science and Engineering department (MSE) hosts an awards dinner, inviting a broad spectrum of its students who are actively involved in materials research – including undergraduate, M.Eng, M.S., and Ph.D....
The Advanced Process Lab Goes Back to School

The Advanced Process Lab Goes Back to School

Graduate student interns in the Advanced Process Laboratory are given a broad exposure to many timely topics in assembly materials, electronics manufacturing and interconnect reliability. More importantly, their individual research assignment provides them an in-depth...
The APL Cleans Up

The APL Cleans Up

High-voltage or high-frequency applications can be intolerant of flux residues remaining on the assembled board surface and so will often be specified as a water wash solder paste assemblies. The recently installed APL Aquastorm 50 is most often configured for a...
Sintering Copper Interconnects in Formic Acid

Sintering Copper Interconnects in Formic Acid

Recognizing the growing need for higher power capability device interconnects, high-end device manufacturers are exploring the possibility of all copper interconnects. Electromigration-resistant copper interconnects can be made using a flip chip dipping process with a...