Universal Appoints Technical Marketing Company to Represent its Advanced Process Lab
Proven solutions provider expands the APL’s customer reach.
APL News
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Synapse Installs Two Universal Instruments Fuzion Production Lines
Leading-edge platform provides dynamic foundation for high-mix electronics manufacturer.
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Universal Features Smart Factory Solutions at APEX
Integrated end-to-end factory solutions drive operational excellence.
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GPD Global Installs Precision Dispenser at Universal’s Advanced Process Lab
Premier dispensing platform provides advanced capabilities for high-end application demands.
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Universal’s APL Shares AREA Consortium Research at SMTAi Technical Sessions
Industry-leading resource provides valuable insight for today’s most challenging electronics assembly processes.
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APL Recognized by Cornell for Innovative Research
At the Annual MSE Awards Gala recently hosted by the Cornell University Materials Science Department our 2018 student intern was recognized for his innovative assembly research in the APL.
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Finetech Partners with AREA Consortium for Precision Assembly
Finetech partners with the AREA Consortium through the installation of a FINEPLACER® Pico bonding system in the Advanced Process Laboratory.
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The Advanced Process Lab Goes Back to School
APL interns from the Cornell University Materials Science program bring the lessons they have learned about electronic packaging assembly and reliability back the classroom to share with their classmates.
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The APL Cleans Up
An Electrovert Aquastorm 50 batch cleaner recently installed in the APL enables the use of water soluble solder paste formulations in your build requests.
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Sintering Copper Interconnects in Formic Acid
APL prepares for next-generation flip chip assembly research with all copper interconnects.
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Engaging the Electronics Assembly Community
Broad range of AREA Consortium research topics presented at the SMTA International conference in Rosemont, IL.
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BTU Pyramax ‘Vacuum’ Installed in the APL
The first BTU Pyramax Vacuum reflow oven is installed in the APL for detailed process capability studies on solder void reduction.