Sintering Copper Interconnects in Formic Acid
APL prepares for next-generation flip chip assembly research with all copper interconnects.
APL News
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Engaging the Electronics Assembly Community
Broad range of AREA Consortium research topics presented at the SMTA International conference in Rosemont, IL.
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BTU Pyramax ‘Vacuum’ Installed in the APL
The first BTU Pyramax Vacuum reflow oven is installed in the APL for detailed process capability studies on solder void reduction.
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Electronic Upgrade for APL Thermal Rod Tester
An electronics facelift improves the APL thermal interface measurement capability.
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Fast and Local – Reflow Where You Need It
A developmental laser selective reflow soldering tool is now operational in the APL assembly laboratory.
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Universal Instruments’ APL Presents Technical Session at IDTechEx Show
Innovative processes empowering the future of flexible substrates in electronics products.
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Universal Brings Odd-Form Capabilities, Technical Know-How to SMTAi
Complementary technology and process solutions provide foundation for lasting profitability.
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Universal’s APL to Deliver Tutorial Session at Michigan SMTA Event
Best practices provide blueprint for success with fast-evolving advanced component challenges.
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APL Welcomes Binghamton University Engineering Students
Engineering students learn electronic assembly process from Universal experts.
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Universal’s APL to Deliver Technical Session at LED A.R.T. Symposium
Innovative design and manufacturing yields robust assembly processes for LED technologies.
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Universal to Demonstrate Fuzion, Share APL Expertise at SMTA International
Leading-edge technologies and expertise combine to deliver powerful solutions and maximum value.
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Universal’s APL to Present Technical Paper at Medical Electronics Symposium
Robust, novel assembly solution enables high-volume production of advanced medical device at 99+% yields.