At the Annual MSE Awards Gala recently hosted by the Cornell University Materials Science Department our 2018 student intern was recognized for his innovative assembly research in the APL.

Finetech partners with the AREA Consortium through the installation of a FINEPLACER® Pico bonding system in the Advanced Process Laboratory.

APL interns from the Cornell University Materials Science program bring the lessons they have learned about electronic packaging assembly and reliability back the classroom to share with their classmates.

An Electrovert Aquastorm 50 batch cleaner recently installed in the APL enables the use of water soluble solder paste formulations in your build requests.

APL prepares for next-generation flip chip assembly research with all copper interconnects.

Broad range of AREA Consortium research topics presented at the SMTA International conference in Rosemont, IL.

The first BTU Pyramax Vacuum reflow oven is installed in the APL for detailed process capability studies on solder void reduction.

An electronics facelift improves the APL thermal interface measurement capability.

A developmental laser selective reflow soldering tool is now operational in the APL assembly laboratory.