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Change the Way You Think About Changeover – Part 3
Every manufacturing environment is different, but here are a few ideas for you to consider when looking at ways to improve your changeover.
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Change the Way You Think About Changeover – Part 2
OEE (Overall Equipment Effectiveness) is a top view metric indicating the gap between the initial and improved performance of a manufacturing unit. It categorizes major reasons for poor performance of equipment, providing the basis for further analysis and improvement in a production process.
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Change the Way You Think About Changeover – Part 1
Productivity can not be measured by the performance of your machines alone. True factory efficiency is driven by several important factors within the manufacturing environment. Understanding and optimizing these factors is the best way to maximize productivity.
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The Way to a Smarter Future – UIC as a Part of the Industries that are about to Evolve
Universal Instruments is committed to working with its industry partners to drive towards a common goal and follow the most efficient path towards a smarter future.
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The Way to a Smarter Future – Where We Are towards Industry 4.0
The majority of people are not fully clear what Industry 4.0 is all about and afraid to make mistakes when implementing new manufacturing strategies. Many don’t seem to know where to start.
Upcoming Events
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SMTA International 2016
Visit Universal on Booth #807 on September 27–28 and see how our solutions experts can help with your specific production challenges.
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SMT Hybrid Packaging 2016
Visit Universal on Channel Partner smartTec’s Hall 7-109 at SMT Hybrid Packaging 2016 on April 26–28 to see demonstrations on our Fuzion1-30 Platform and Polaris Multi-Process Assembly Cell, or discover how our solutions experts can help with your specific production challenges.
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NEPCON China 2016
Visit Universal on Channel Partner Gentron’s Booth# B-1J35 at NEPCON China 2016 on April 26–28 and see two new innovative high-volume production solutions: the Flexbond™ automated high-volume hot bar bonding platform and the high-speed DIMM Socket Feeder.
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APEX 2016
Visit Universal on Booth 2441 at the 2016 IPC APEX EXPO 2016 on March 15–17 and see two pioneering additions to the industry’s most comprehensive solutions portfolio: the Uflex™ modular automation platform and the Flexbond™ hot bar bonding platform.
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SEMICON China 2016
Visit Universal on Channel Partner Sigmatek’s Booth# 1531 at SEMICON Shanghai 2016 on March 15–17 and learn how Universal’s team of solutions experts can help solve your manufacturing challenges.