Pioneering semiconductor solution to help cultivate the next generation of advanced packaging engineers. April 14, 2022 – Universal Instruments held a ribbon-cutting ceremony for Binghamton University’s acceptance of the company’s High-Speed Wafer Feeder (HSWF)...
Highly regarded manufacturers’ representative enriches customer experience in Midwest region. January 6, 2022 – Universal Instruments has strengthened its upper Midwest US customer coverage with the appointment of B.R. Peterson Associates as its Channel Partner...
Pioneering solution enables efficient volume manufacturing for complex multi-die devices. December 1, 2021 – Universal Instruments will exhibit on Booth 1031 at the SEMICON West trade show in San Francisco, CA on December 7–9. On the booth, Universal will...
Knowledge-sharing event strengthens relationships, improves supply chain efficiencies. June 4, 2020 – Universal Instruments brought its supplier base together at an informal and collaborative Supplier Day at its Conklin, NY, USA headquarters. The single-day...