SURFACE

MOUNT

FUZION PLATFORM

Fuzion Platform

Fuzion® is Universal’s flagship platform, leveraging the latest generation of head and feeder technologies, and software tools for maximum performance. Fuzion solutions maximize utilization, Overall Equipment Effectiveness (OEE), and productivity while delivering the lowest cost per placement for any environment or product mix.

AtvantisV Platform

AdvantisV™ is a next-generation midrange platform that combines the best in technology and performance with a low entry price and unmatched scalability. The AdvantisV portfolio features powerful, flexible platforms that handle a wide range of applications and readily adapt to new ones. With class-leading capabilities at an attractive price point, AdvantisV delivers affordable performance without compromise.

FUZIONOF Platform

FuzionOF™ continues Universal’s lineage of implementing odd-form solutions on a standard surface mount platform, delivering unmatched performance for a diverse range of pin-in-paste odd-form, surface mount odd-form and standard surface mount applications.

Fuzion Platform

FUZION PLATFORM

For electronics manufacturers who demand an agile, flexible production model without limitations, Fuzion® is the pinnacle of platform performance. Fuzion is the industry’s most adaptable and capable platform, delivering profitable productivity for any manufacturing model from NPI to ultra-high volumes. Fuzion drives operational excellence, enabling manufacturers to build any product at any time, accelerate new product introduction and ramp to volume, and maximize utilization, quality, and yield.

  • 1, 2, 4-beam variants
  • Extra-capacity (XC) models with up to 272 feeder inputs
  • Versatile multi-task odd-form (OF) model
  • Throughput up to 140,000 cph per module
  • Industry-leading cost per placement, flexibility and accuracy
  • Largest board size capability
  • Closed-loop processes to ensure the highest yields
  • Maximum performance and utilization for any volume/product mix
  • Comprehensive toolset to accelerate NPI and achieve 100% first-pass yield
  • Ability to prototype on a single module
  • Lowest cost of operation and ownership
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FUZION MODELS & SPECS
  • FuzionOF – Versatile IC placement platform perfect for special processes such as Pin-in-Paste, Flip Chip and OFA
  • Fuzion1-11 – Flexible IC placement platform perfect for NPI or complex SMT
  • Fuzion1-30 – Superb for high-mix NPI environments and large board applications. Also a high-volume line booster.
  • Fuzion2-14 – Best-in-class multi-function machine with fast placement of a wide component range for applications where flexibility and performance per line length are important
  • Fuzion2-37 – A true multi-purpose platform. A versatile stand-alone prototyping solution, a flexible line balancer, or a high-performance multi-function solution.
  • Fuzion2-60 – Flexible, high-speed productivity for medium-volume environments. A powerful line booster solution or high-performance small part placer.
  • FuzionXC2-37 – High-capacity NPI, all-in-one, line balancer, or multifunction solution with a full component range
  • FuzionXC2-60 – Cost-efficient, high-performance turret replacement or high-input chip placer
  • Fuzion4-120 – Powerful performance for high-volume production environments: Consumer, Mobile, Notebook, Automotive
Max Throughput (cph)
FuzionOF
16,500
Fuzion1-11
16,500
Fuzion1-30
35,000
Fuzion2-14
30,750
Fuzion2-37
48,000
Fuzion2-60
66,500
FuzionXC2-37
43,000
FuzionXC2-60
65,500
Fuzion4-120
140,000
Accuracy (µm) at greater than 1.00 Cpk
FuzionOF
±38 (Chips) / ±27 (ICs)
Fuzion1-11
±38 (Chips) / ±27 (ICs)
Fuzion1-30
±34 (Chips) / ±34 (ICs)
Fuzion2-14
±38 (Chips) / ±27 (ICs)
Fuzion2-37
±34 (Chips) / ±27 (ICs)
Fuzion2-60
±34 (Chips) / ±34 (ICs)
FuzionXC2-37
±34 (Chips) / ±27 (ICs)
FuzionXC2-60
±34 (Chips) / ±34 (ICs)
Fuzion4-120
±34 (Chips) / ±34 (ICs)
Max Board Size
FuzionOF
508 x 813mm
Fuzion1-11
508 x 813mm
Fuzion1-30
508 x 1016mm
Fuzion2-14
508 x 813mm
Fuzion2-37
508 x 1016mm
Fuzion2-60
508 x 1016mm
FuzionXC2-37
610 X 1300mm
FuzionXC2-60
610 X 1300mm
Fuzion4-120
500 x 700mm
Max Feeder Inputs (8mm)
FuzionOF
120 (2 ULC)
Fuzion1-11
120 (2 ULC)
Fuzion1-30
136
Fuzion2-14
120 (2 ULC)
Fuzion2-37
128 (1 ULC)
Fuzion2-60
136
FuzionXC2-37
272
FuzionXC2-60
264
Fuzion4-120
144
Component Range
FuzionOF
0201 – 150mm sq, 25mm tall
Fuzion1-11
0201 – 150mm sq, 25mm tall
Fuzion1-30
01005 – 30mm sq
Fuzion2-14
0201 – 150mm sq, 25mm tall
Fuzion2-37
01005 – 150mm sq, 25mm tall
Fuzion2-60
01005 – 30mm sq
FuzionXC2-37
01005 – 150mm sq, 25mm tall
FuzionXC2-60
01005 – 30mm sq
Fuzion4-120
01005 – 30mm sq

ADVANTISV PLATFORM

AdvantisV™ leverages high-end base technologies and easily integrated premium options to deliver cost-effective, value-driven productivity in low-margin environments. This versatility, coupled with a robust architecture with minimal maintenance requirements, provides investment protection and a low cost of ownership. AdvantisV incorporates a highly accurate architecture and closed-loop controls for superior yields. It also generates exceptional and consistent output across a range of environments from NPI to volume production. AdvantisV has all the functionality to meet today’s challenges, with a growth path for tomorrow’s.

  • 1 and 2-beam variants utilizing flagship Fuzion base architecture
  • Throughput up to 66,500 cph per module
  • Complementary high-speed and multifunction models
  • Minimal entry price and initial investment
  • Simplified base configurations, easily integrated options
  • Premium options, including advanced NPI toolbox
  • Broadest component range and board size capabilities
  • Class-leading performance and technologies for long usable life
  • Low cost of ownership with minimal maintenance requirements
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AVANTISV MODELS & SPECS
  • AdvantisV1-07 – A versatile IC placement platform, perfect for special processes such as pin-in-paste and OFA
  • AdvantisV1-30 – Superb for high-mix NPI environments and large board applications. Also a high-volume line booster solution.
  • AdvantisV2-60 – Flexible, high-speed productivity for medium-volume environments. Also a powerful line booster solution or high-performance small part placer.
Max Throughput (cph)
AdvantisV1-07
16,500
AdvantisV1-30
35,000
AdvantisV2-60
66,500
Accuracy (µm) at greater than 1.00 Cpk
AdvantisV1-07
±38 (Chips) / ±27 (ICs)
AdvantisV1-30
±34 (Chips) / ±34 (ICs)
AdvantisV2-60
±34 (Chips) / ±34 (ICs)
Max Board Size
AdvantisV1-07
508 x 813mm
AdvantisV1-30
508 x 1016mm
AdvantisV2-60
508 x 1300mm
Max Feeder Inputs (8mm)
AdvantisV1-07
128 (1 ULC)
AdvantisV1-30
136
AdvantisV2-60
136
Component Range
AdvantisV1-07
0201 – 150mm sq, 40mm tall
AdvantisV1-30
01005 – 30mm sq
AdvantisV2-60
01005 – 30mm sq

FUZIONOF PLATFORM

FuzionOF™ features the highest available odd-form automation throughput to reduce cycle times and eliminate bottlenecks. It handles a full range of standard SMT and non-traditional components up to 150mm square and up to 40mm tall, with 5kg placement force. With the most complete range of component handling and input types, a wide variety of standard tooling, and custom design and implementation services, FuzionOF addresses virtually any odd-form application. It also incorporates precise, repeatable, closed-loop processes that reduce defects, rework and waste. FuzionOF transforms back-end assembly into a strategic advantage.

  • Single-beam platform with throughput up to 16,500 cph
  • Full range of SM components to pin-in-paste and all odd parts in between
  • 0201 – 55mm square (SFoV) and 150mm square (MFoV)
  • Components up to 33mm tall, up to 5kg placement force
  • Adjustable gripper and full array of odd-form nozzles; broad tooling portfolio
  • Highest online capacity, widest range of feeder input types
  • Improve output and yields vs. manual assembly; accelerate ROI with rapid payback
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FUZIONOF MODELS & SPECS
  • FuzionOF – Versatile IC placement platform perfect for special processes such as Pin-in-Paste, Flip Chip and OFA
Throughput (cph)
FuzionOF
16,500 (Max) / 11,400 (1-Bd IPC Chips)
Accuracy (µm) at greater than 1.00 Cpk
FuzionOF
±38 (Chips) / ±27 (ICs)
Max Board Size
FuzionOF
508 x 813mm (20 x 32")
Max Feeder Inputs (8mm)
FuzionOF
120 (2 ULC)
Component Range (mm)
FuzionOF
(0201)_ .25 x .5 x .15 (Min) / 150 square & up to 25 tall