ADVANCED

PACKAGING

FUZIONSC PLATFORM

FuzionSC™ is Universal Instruments’ next-generation semiconductor platform, offering the industry’s most precise accuracy, highest flip chip throughput, and widest component range.

HIGH-SPEED WAFER FEEDER

The High-Speed Wafer Feeder (HSWF) is the world’s fastest rapid-exchange multi-die feeder. Combined with Universal’s FuzionSC™ Platform, it is the ultimate multi-die solution for heterogeneous integration.

FLEXION WAFER FEEDER

Embrace the convergence era of electronics assembly with the Flexion™ direct die feeder. This revolutionary technology enables the presentation of wafer-level devices to Universal’s FuzionSC Platform without incurring costly packaging charges.

FUZIONSC PLATFORM

Are high precision die and chip applications increasing your manufacturing costs while lowering your yields, resulting in decreased profits?

Universal Instruments’ FuzionSC™ Platform offers a complete solution to flip chip package applications by blending the strict accuracy demands of Semiconductor assembly with the speed and robustness of Universal’s Fuzion Platform. With the ability to handle all facets of flip chip assembly, FuzionSC reduces operating and capital costs by maximizing throughput per floor-space.

  • Silicon/SMT, high-accuracy/high-speed assembly
  • High accuracy: (±10µm, < 3µm placement repeatability)
  • Dual- or single-beam, multiple-spindle heads
  • Full range of die and component types and sizes
  • Versatile substrate handling
  • Broadest range of feeding platforms
  • Low-maintenance, accurate over time
  • Vision robustness recognition of pins or logic pads
  • Stacking support (POP)
  • Low-force capability
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FUZIONSC MODELS & SPECS
  • FuzionSC1-11 – Flexible configuration delivering best-in-class throughput and accuracy for semiconductor applications. Offers the widest component range without reconfiguration.
  • FuzionSC2-14 – High-volume configuration delivering best-in-class throughput and accuracy for semiconductor applications. Maintains superior flexibility over dedicated solutions to support technology changes.
Max Throughput (cph)
FuzionSC1-11
16,500
8,400 (4-Bd IPC Chips)
FuzionSC2-14
30,750
14,200 (4-Bd IPC Chips)
Accuracy (µm) at greater than 1.00 Cpk
FuzionSC1-11
±10 (Array Devices/Flip Chip)
±38 (Passives/Chips)
FuzionSC2-14
±10 (Array Devices/Flip Chip)
±38 (Passives/Chips)
Max Board Size
FuzionSC1-11
508 x 813mm
FuzionSC2-14
508 x 813mm
Max Feeder Inputs (8mm)
FuzionSC1-11
120 (2 ULC)
FuzionSC2-14
120 (2 ULC)
Component Range
FuzionSC1-11
0201 – 150mm sq, 25mm tall
FuzionSC2-14
0201 – 150mm sq, 25mm tall

HIGH-SPEED WAFER FEEDER

Consumer, Automotive and IoT devices are getting smaller and thinner, 2.5D and SiP multi-die packages are becoming more complex, InFO and Panel Fan-Out are driving large-format batch processing, and volume demands are rising. These new challenges demand a comprehensive solution that breaks traditional boundaries for efficient multi-die assembly.

The High-Speed Wafer Feeder (HSWF) meets these challenges head-on, delivering value with the precision, performance and flexibility to handle today’s most advanced applications, while also enabling you for those to come.

  • Maximum die size range with thinnest die
  • Maximum panel size processing up to 635mm x 610mm on FuzionSC
  • 14 high-precision (sub-micron X,Y,Z) servo-driven pick heads
  • High-precision (sub-micron X,Y,Z) servo-driven ejector
  • 100% pre-pick vision and die alignment
  • One-step “wafer-to-placement” handoff
  • Synchronous wafer stretch and storage
  • 16K cph dual wafer tables
  • Up to 52 unique wafers types at once; 100mm, 150mm, 200mm, 300mm
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HSWF MODELS & SPECS
  • FuzionSC1-11 – Flexible configuration delivering best-in-class throughput and accuracy for semiconductor applications. Offers the widest component range without reconfiguration.
  • FuzionSC2-14 – High-volume configuration delivering best-in-class throughput and accuracy for semiconductor applications. Maintains superior flexibility over dedicated solutions to support technology changes.
Single-Bay HSWF
Placement Mode
Flip Chip (Circuit Down)
Die Attach (Circuit Up)
Wafer Tables
1
Wafer Cartridges
4
Throughput (cph)
Flip Chip: 8,000
Die Attach: 7,400
Die Size (Min)
0.5mm x 0.5mm
0.1mm x 0.1mm (phase 2)
Die Size (Max)
40mm x 40mm
70mm x 70mm (phase 2)
Die Thickness (μm)
50 to 1,000
10 to 1,000 (phase 2)
Max Part Numbers / FuzionSC
Up to 26 die types
Cassette Capacity
13 wafers/cassette x 2
25 wafers/cassette x 1
Wafer Size (mm/inches)
100/4”, 150/6”, 200/8”, 300/12”
Nozzle / Ejector Change
Auto Changer
Nozzle Changer Slots
28
Ejector
4 Ejecter Changer
Traceability
GEM/SQL
Mapping System
Local Map Support
Dual-Bay HSWF
Placement Mode
Flip Chip (Circuit Down)
Die Attach (Circuit Up)
Wafer Tables
2
Wafer Cartridges
8
Throughput (cph)
Flip Chip: 16,000
Die Attach: 14,400
Die Size (Min)
0.5mm x 0.5mm
0.1mm x 0.1mm (phase 2)
Die Size (Max)
40mm x 40mm
70mm x 70mm (phase 2)
Die Thickness (μm)
50 to 1,000
10 to 1,000 (phase 2)
Max Part Numbers / FuzionSC
Up to 52 die types
Cassette Capacity
13 wafers/cassette x 2
25 wafers/cassette x 1
Wafer Size (mm/inches)
100/4”, 150/6”, 200/8”, 300/12”
Nozzle / Ejector Change
Auto Changer
Nozzle Changer Slots
56
Ejector
8 Ejecter Changer
Traceability
GEM/SQL
Mapping System
Local Map Support

FLEXION WAFER FEEDER

Flexion direct die feeders support a full complement of high-volume flip chip and bare die applications. Flexion enables high-speed die delivery from wafer over a wide range of die sizes. When integrated with the flexible FuzionSC™ Platform, Flexion eliminates the need for dedicated die presentation systems to streamline processes and improve efficiency.

  • Ideal for SiP applications
  • High-mix to high-volume support
  • Handles up to 300mm wafers
  • Inline barcode scanning supports ALPs or Inkless wafer maps
  • Supports up to 4 per machine
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FLEXION MODELS & SPECS
  • FuzionSC1-11 – Flexible configuration delivering best-in-class throughput and accuracy for semiconductor applications. Offers the widest component range without reconfiguration.
  • FuzionSC2-14 – High-volume configuration delivering best-in-class throughput and accuracy for semiconductor applications. Maintains superior flexibility over dedicated solutions to support technology changes.
Flexion Specifications
Max Throughput (uph)
Flip Chip: 5,400 for 1mm die
Direct Die: 4,500 for 1mm die
CE Certified
Yes
Operating System
Windows® Embedded
Wafer Specification
Maximum Size: 300mm (12”)
Minimum Size: 150mm (6”)
Expansion Depth: 2.0mm – 6.0mm or 0.0mm (unexpanded)
Vision Recognition Methods
Thresholding, Pattern Matching, Corner & Bump Detection, Wafer Mapping
Die Specification
Minimum Size (L x W): 0.7mm x 0.7mm (0.027” x 0.027”)
Maximum Size: (L x W) 11.0mm x 11.0mm (0.43” x 0.43”)
Minimum Thickness: 75 μm (0.003”)
Maximum Thickness: 2.0mm (0.078” nominal)
Die Material: Silicon, Gallium Arsenide, Ceramic, Glass
Ball Types: Ball Bumps, Stud Bumps
Pick PPM
400
Wafer Expansion
Integrated, Online Expansion
Wafer Capacity
13-Slot Cassette
Feeder Quantity per Fuzion
2
Wafer Mapping Support
ALPS and Ink-less Die