Universal Automates Success at SMT Hybrid Packaging 2015 May 5-7, 2015 Exhibition Centre Nuremberg Nuremberg, Germany Visit us on Hall 7 Stand 7-221 Official Show Website
Flexible technology lineup enables winning formula for automating contemporary odd-form challenges. April 27, 2015 – Universal Instruments will display two solutions from its automated odd-form assembly portfolio at the SMT Hybrid Packaging trade show to be held...
From high-speed chip placement to multi-span through-hole and more, comprehensive portfolio enables complete factory automation. April 15, 2015 – Universal Instruments will feature two offerings from the industry’s broadest technology portfolio at the 2015...
Universal Demonstrates SM and IM Platforms at NEPCON China April 21-23, 2015 Shanghai World Expo Exhibition & Convention Center Visit us on Channel Partner Gentron’s Stand: B-1F16
Cutting-edge research collaboration enables technology leadership in electronics assembly market. April 8, 2015 – On March 25–26, Universal Instruments’ Advanced Process Lab (APL) held its first AREA Consortium meeting of 2015. The event was held at the...
