Universal Instruments Low Force Placement Solutions for Advanced Packaging
Low force method using LMR (Low Mass Redesign) spindle assemblies.
January 2015
Monthly Archives
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The Anatomy of a Superior Placement Head
With so many placement head design concepts available, how do you tell which one is the best? The answer lies in the anatomy of the placement head. Whether it’s rotary, inline, small or large, each has its unique characteristics.
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How Through-Hole Technology is Helping the World Become Greener
CFL and LED lighting are helping to increase the demand for new radial through-hole equipment.
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Simplifying Complex NPI
Imagine for example, combining active die components, WLCSPs, uBGAs and passive SMDs with its interconnecting media such as solder paste and flux into a substrate. It will require series of processes that could consume certain length of time and multiple equipment utilization before it can be completed.