
New 0402 Long-Life Ceramic Nozzle
You might ask, “What’s the difference between this nozzle and the older conical 0402 ceramic nozzle?” Simply put, we think this latest design is a far superior option. Here’s why…
You might ask, “What’s the difference between this nozzle and the older conical 0402 ceramic nozzle?” Simply put, we think this latest design is a far superior option. Here’s why…
Semiconductor packaging has traditionally followed dedicated equipment sets for given package formats or processes dictated by Bare Die or Flip Chip assembly. New package functionality, performance, miniaturization, low cost materials are driving the ever import Time to Market product life.