Universal Instruments Talked about Future Intelligent Manufacturing Opportunities
Universal Instruments shares market perspective with industry experts in Intelligent Manufacturing Industry Development Forum at CEIA Tianjin, China.
October 2014
Monthly Archives
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Are Your SMT Machines ESD-Safe?
There is no such thing as an ESD-safe machine without an ESD-safe nozzle.
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Universal to Highlight Advanced Packaging Solutions at MEPTEC Symposium
Process expertise complements mature and versatile technologies to address diverse packaging and assembly requirements
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Why Through-Hole Technology is Still Thriving in a High-Tech World
Through-hole technology is still alive and has a very important place in our current high-technology world. There are many uses for through-hole components in our ever-shrinking electronics landscape.
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Pad Location Relative to Laminate Glass Weave Can Impact Strength and Fatigue Life of Pad
Pad cratering occurs when there is a break within the resin between the copper foil and outermost layer of fiberglass of a PCB (cohesive), or at the resin-to-glass interface (adhesive).
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CEIA Tianjin 2014
Join Universal Instruments on Booth 7-C20, Electronics Manufacturing Technology Forum, October 22nd, 11:30am–12:00pm, for a presentation on SMT Process Controls and Solutions.
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Odd-Form Assembly Automation –Impact of Mechanics on Electronic Assembly
Is the mechanical quality and repeatability of the component suitable for automation?
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Odd-Form Assembly Automation – Lead-to-Hole Ratio
Lead-to-hole ratio is the amount of variance between the largest diameter/diagonal of the lead to the smallest diameter of the hole. This factor has to be considered in the determination of viability for automation.
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2014 MEPTEC Semiconductor Packaging Technology Symposium
Visit Universal Instruments on Table 8, October 23