
Universal Instruments Talked about Future Intelligent Manufacturing Opportunities
Universal Instruments shares market perspective with industry experts in Intelligent Manufacturing Industry Development Forum at CEIA Tianjin, China.
Universal Instruments shares market perspective with industry experts in Intelligent Manufacturing Industry Development Forum at CEIA Tianjin, China.
There is no such thing as an ESD-safe machine without an ESD-safe nozzle.
Process expertise complements mature and versatile technologies to address diverse packaging and assembly requirements
Through-hole technology is still alive and has a very important place in our current high-technology world. There are many uses for through-hole components in our ever-shrinking electronics landscape.
Pad cratering occurs when there is a break within the resin between the copper foil and outermost layer of fiberglass of a PCB (cohesive), or at the resin-to-glass interface (adhesive).
Join Universal Instruments on Booth 7-C20, Electronics Manufacturing Technology Forum, October 22nd, 11:30am–12:00pm, for a presentation on SMT Process Controls and Solutions.
Is the mechanical quality and repeatability of the component suitable for automation?
Lead-to-hole ratio is the amount of variance between the largest diameter/diagonal of the lead to the smallest diameter of the hole. This factor has to be considered in the determination of viability for automation.
Visit Universal Instruments on Table 8, October 23