October 30, 2014 – October 22nd 2014, Universal Instruments participated in the Intelligent Manufacturing Industry Development Forum at the China Circum-Bohai Electronics Manufacturing and Intelligent Automation Exhibition (CEIA) in Tianjin, China. Glenn Farris,...
October 25, 2014 – “There is no such thing as an ESD-safe machine without an ESD-safe nozzle.” Universal Instruments was a pioneer in ESD-safe (Electrostatic Discharge) machinery and tooling, so when an opportunity to validate this investment presented itself…...
Process expertise complements mature and versatile technologies to address diverse packaging and assembly requirements October 20, 2014 – Universal Instruments will be exhibiting on Table #8 at the 2014 MEPTEC Semiconductor Packaging Technology Symposium in...
October 16, 2014 – When I meet people in the electronics industry and tell them I am the Marketing Manager for through-hole products at Universal Instruments, they almost always say “You still sell those machines? I thought through-hole technology is DEAD”. I...
October 14, 2014 – Pad cratering occurs when there is a break within the resin between the copper foil and outermost layer of fiberglass of a PCB (cohesive), or at the resin-to-glass interface (adhesive). The pad is separated from the PCB, leaving a crater on...
