Seminars to focus on key challenges and solutions for the Chinese electronics manufacturing market August 19, 2014 – Universal Instruments invites electronics manufacturers to join the company for an informative technology seminar held on August 26–27 in Rose...
August 18, 2014 – Universal Instruments is going to hold a China market-focused seminar at NEPCON Shenzhen on August 26 & 27, in Rose Hall #2, 5th floor, Shenzhen Convention Center, and the Advanced Process Laboratory (APL) will present the precise and...
August 17, 2014 – Universal Instruments’ Dr. Babak Arfaei is going to present “Effect of Sn Grain Morphology on Reliability of Lead Free Solder Joints in Thermal Cycling Tests” on August 25 at iNEMI Workshop on Board Assembly & Test Technology in Shenzhen,...
August 1, 2014 – It has been more than 5 years when the first generation of Package-on-Package came into form. The primary objective is to combine the memory and the application specific integrated circuit (ASIC) to use much lesser real property this shrinking...